SSTCA series of thermally conductive adhesive has excellent thermal effectiveness, low thermal expansion, fully insulated non-conductive, effectively eliminating the damaging effects of electronic components produced by temperature changes due to work, and can be cured at room temperature or heated in curing before SSTCA series has excellent flowability; after curing may also be used interchangeably and will not cold emerge from the protective casing, a smooth surface which has no potting volatiles generated.
After curing the product has excellent resistance to toxicity, in general do not have to solder and coatings for special treatment, and is widely used in electronic products, heat bonding and heat sink or metal casing
Applications：Power modules, electronic product, controller, LED lighting, telecommunication, NB, PC, tablet.
|A/B Mixing Ratio||-||1:1||-|
|Viscosity||Brookfield HB S02@10~30rpm||6000~8000||cps|
ASTM D5470 Modified *1
|Withstand Voltage||ASTM D149||>9||KV/mm|
|Volume resistivity||ASTM D257||≥3x1014||Ω．cm|
|Flammability class(0.3mm)||UL 94||V-0||UL No. E352845|
|RoHS. Testing sample thickness:1.0mm.|
|*1: Thermal conductivity test thickness is 1/2/3T according to ASTM D5470 and tested with LW-9389 machine. Tolerance is ± 10%.|
|*2: Development test capacity: 100~200g.|
*These data are provided for reference only. Engineers are reminded to test the material in varied application.