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  • Epoxy (REUV/READ)

    Product Name:Epoxy
    Type:REUV-55series、REUV-66series、READ D-series、READ S-series
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    Description:

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REUV Specifications:

READ D-series Features:

  • Two-part epoxy resin
  • High flow and fast operation after mixing
  • High adhesion on metal and plastic. High solvent resistance, moisture resistance and high reliability after curing
    RHigh temperature resistance after curing
  • 2011/65/EU Rohs Certification

READ S-series Features:

  • One-part epoxy resin, easy to use
  • High flow and fast operation, not easy to deform after dispensing
  • High adhesion on metal and plastic. High solvent resistance, moisture resistance and high reliability after curing
  • High Tg and high temperature resistance after curing
  • 2011/65/EU Rohs Certification

Typical Uncured Properties READ D-series Test Description Test Method
Filler Type NONE    
Viscosity @ 25 ℃ A=2600~3000 cPs Brookfield CP-51 @ 5 rpm ATM-0018
B=1000~1500cps
Thixotropic Index N/A Viscosity @ 0.5/visc. @ 5 rpm ATM-0089
Work Life @ 25 ℃(Mixed) 2~3hr. 25% increase in viscosity @ RT ATM-0085
Storage Life @ 25 ℃(Unmixed) 1 year    
Cure Process Data READ D-series Test Description Test Method
Mixing ratio 10A+1B    
Recommended Cure Condition 1hr. @150 ℃    
Minimum alternative cure 10 minutes @ 100 ℃    
5 minutes @ 120 ℃    
Physiochemical Properties–Post Cure READ D-series Test Description Test Method
Ionics Chloride 420 ppm Teflon flask 5g sample / 20-40
mesh 50g DI water 100 ℃ for
24 hours
ATM-0007
NH4+ 400 ppm
Potassium 5 ppm
Weight Loss @ 300 ℃ 0.2% Thermogravimetric analysis ATM-0073
Glass Transition Temperature 100 ℃ TMA penetration mode ATM-0055
Thermal conductivity N/A   ASTM 5470D
Dielectric Strength >20KV/mm    
Volume Resistivity (Ω-cm) @25 ℃ >1013    
Modulus (psi) 503450 DMA  
Shore D Hardness 85    
Coefficient of Thermal Expansion
          Below Tg
56 ppm/ ℃ TMA expansion mode ATM-0055
          Above Tg 230ppm/ ℃    
Mechanical Properties–Post Cure READ D-series Test Description Test Method
Shear Strength @ 25 ℃ >25 kgf/cm2 100 x 10 mm pp(plastics) on AL ATM-0052

Typical Uncured Properties READ S-series Test Description Test Method
Filler Type Silica    
Viscosity @ 25 ℃ 20,000~22,500 cPs Brookfield CP-51 @ 5 rpm ATM-0018
Thixotropic Index 1.9 Viscosity @ 0.5/visc. @ 5 rpm ATM-0089
Work Life @ 25 ℃ 12 hours 25% increase in viscosity @ RT ATM-0085
Storage Life @ -40 ℃ 1 year    
Cure Process Data READ S-series Test Description Test Method
Recommended Cure Condition 10 minutes @ 120 ℃    
  30 minutes @ 100 ℃    
  60 minutes @ 90 ℃    
Physiochemical Properties–Post Cure READ S-series Test Description Test Method
Ionics Chloride 20 ppm Teflon flask 5g sample / 20-40
mesh 50g DI water 100 ℃ for
24 hours
ATM-0007
Sodium 2 ppm
Potassium < 1 ppm
Weight Loss @ 300 ℃ 0.2% Thermogravimetric analysis ATM-0073
Glass Transition Temperature 120 ℃ TMA penetration mode ATM-0055
       
Modulus Below Tg 10 GPa DMA  
    Above Tg 0.3 GPa DMA  
Coefficient of Thermal Expansion

          Below Tg

28 ppm/ ℃ TMA expansion mode ATM-0055
          Above Tg 84 ppm/ ℃    
Mechanical Properties–Post Cure READ S-series Test Description Test Method
Die Shear Strength @ 25 ℃ 23 kgf/die 2 x 2 mm Si die on Ag/Cu LF ATM-0052