Product Name：Thermally Conductive Adhesive
Type：SSTCA-010H / SSTCA-010L / SSTCA-015H / SSTCA-015L
Package：Minimum package for 1KG
Description：Excellent thermal effectiveness, low thermal expansion, fully insulated non-conductive, effectively eliminating the damaging effects due to the operating temperature of electronic components produced, and can be cured at room temperature or under heating, in series before curing has excellent SSTCA mobility; after curing will not be because of hot and cold alternately emerge from the protective shell, its surface smooth potting no volatiles generated.
SSTCA series of thermally conductive adhesive has excellent thermal
effectiveness, low thermal expansion, fully insulated non-conductive,
effectively eliminating the damaging effects of electronic components produced
by temperature changes due to work, and can be cured at room temperature or
heated in curing before SSTCA series has excellent flowability; after curing may
also be used interchangeably and will not cold emerge from the protective
casing, a smooth surface which has no potting volatiles generated.
After curing the product has excellent resistance to toxicity, in general do not have to solder and coatings for special treatment, and is widely used in electronic products, heat bonding and heat sink or metal casing
Power modules, electronic product, controller, LED lighting, telecommunication, NB, PC, tablet.
Curing time :
SSTCA Series Silicone placed eight hours at room temperature can be naturally cured, the curing time is shortened with increasing temperature (see table below).
|Color||Visual||A-Black, B-White||A-Black, B-White||A-Black, B-White||A-Black, B-White||-|
|A/B Mixing Ratio||-||1:1||1:1||1:1||1:1||-|
Thermal Conductivity (Vertical)
|ASTM D5470 Modify||0.65||0.65||1.5||1.5||W/mK|
|Heat cure (90℃)||-||30||30||30||30||minute|
|Volume resistivity||ASTM D257||≥3X1014||≥3X1014||≥3X1014||≥3X1014||Ω.cm|